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Warpage in Insulated Gate Bipolar Transistor (IGBT) module is induced by the unavoidable mismatch of materials and asymmetric structure in almost every packaging process. The high level of warpage and thermal stress is introduced during reflow processes, which can impact the IGBT reliability. Pre-warping substrate method has been used as industry practice for reducing warpage due to reflow. The method...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
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