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In MEMS realization of high frequency ultrasonic array transducer, electrical impedance matching may become difficult for the reason of the miniaturization of the piezo-array elements. In this study, the electrical impedance of the array elements is estimated first by using KLM model, and then calculated by using finite elements method (FEM), in the case of a LiNbO3 based 30MHz array transducer. The...
In this paper, a novel petaloid hollow Cu interconnection for interposer is presented, its stress can be released by free ends face to hollow Cu interconnection center, and its fabrication process for Si substrate and glass substrate are also presented. Stress distribution and Max. stress of interposer with petaloid hollow Cu interconnection comparison with normal TSV is simulated and analyzed by...
Thermal management is a key challenge for TSV (through-silicon-via) enabled integrated three-dimensional microsystem and integrated microchannel cooling is believed as a promising technology because of high inner-chip cooling efficiency. In this paper, a compatible process is presented for integrating microchannel into TSV interposer and three typical types of integrated microchannel are implemented...
In this paper, a novel Si interposer for hermetical MEMS oriented System-in-Package application is presented and it is a low stress, scalable platform with a stress releasing function. It's composed of Si posts which are Air-gapped from Si interposer substituting traditional Copper TSVs to function as electrical interconnection paths, re-distribution layer (RDL) and landing pads for chip stacking...
Vacuum preloading is one of the effective technologies for consolidating soft foundation. The consolidation mechanism of vacuum preloading is explained. Meanwhile, the computing methods of vacuum preloading are classified, the advantages and disadvantages of the axial symmetry consolidation theory, the half analysis theory of horizontal movement and the three dimension value solution, are evaluated...
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