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The active liquid cooling system is urgently required for heat dissipation of high-power electronics. However, the key part of the system, micro-pump, is still challenged by the bearing failure problem caused by the mechanical friction. We designed a hydro-dynamically levitated centrifugal micro-pump, providing a 1.0 L/min flow rate and a 45 KPa pressure head at 20000 rpm with the size as small as...
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