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A process to make self-curved diaphragms by engineering residual stress in thin films has been developed to construct highly responsive piezoelectric micromachined ultrasonic transducers (pMUT). This process enables high device fill-factor for better than 95% area utilization with controlled formation of curved membranes. The placement of a 0.65 µm-thick, low stress silicon nitride (SiN) film with...
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