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According to electronization for car, many units which have thermal sources are mounted in vehicle and some heated units are broken down in operation. This problem can be caused by a big accident. Because of this problem, heat generation of electronic unit is a big issue in a recent automotive business. Recently, most automakers and auto-parts suppliers always have been tried to rapidly predict or...
We present the investigation of magnetic properties of spin-glass system. From X-ray diffraction patterns of , refined with Rietveld's refinement method, its structure is determined to be cubic spinel with space group and the lattice parameter of . From temperature-dependent magnetization curves under 1000 Oe,...
In flip chip package, the majority of heat is from the die side and a temperature gradient builds up from the chip to substrate through the solder joint and underfill. This will induces biased atomic flux from hot end to cold end in the solder. Even in electromigration test vehicle, the joule heating from the Al trace at chip side is also higher than substrate side. Any small temperature difference...
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