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We have employed high resolution synchrotron radiation x-rays 3D imaging techniques, both tomography and laminography, to study the electromigration (EM) failure mechanism in flip-chip solder joints. In these studies, the ex-situ imaging of the early-stage damage evolution at the interface between UBM and solder balls, revealed that the EM induced failure mode of solder joints could be described by...
In order to remove the effect of current crowding on electromigration, thick Cu under-bump metallization has been widely adopted in the electronics industry. Three-dimensional (3-D) integrated circuits, using through Si via Cu column interconnects, is being developed, and it seems that current crowding may not be a reliability issue. However, statistical experiments and 3-D finite element simulation...
In flip chip package, the majority of heat is from the die side and a temperature gradient builds up from the chip to substrate through the solder joint and underfill. This will induces biased atomic flux from hot end to cold end in the solder. Even in electromigration test vehicle, the joule heating from the Al trace at chip side is also higher than substrate side. Any small temperature difference...
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