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Wafer-level testing is an important process in integrated circuit (IC) manufacturing to enhance the yield and reduce costs. The development of a vertical probe card enables the testing of low-voltage and high-frequency devices with reduced probe lengths compared to conventional probe cards. Despite these advantages, crosstalk noise and electromagnetic interference (EMI) have alarmingly become a serious...
In this paper, the shielded coil structure using the ferrites and the metallic shielding is proposed. It is compared with the unshielded coil structure (i.e. a pair of circular loop coils only) to demonstrate the differences in the magnetic field distributions and system performance. The simulation results using the 3D Finite Element Analysis (FEA) tool show that it can considerably suppress the leakage...
In this paper, the authors have experimentally investigated the radiated emission spectrum from the flexible printed circuit (FPC) cables operating with 50 or 100 MHz signal to analyze the effect of structure, dimension and conductor line arrangement on the radiated emission of the cable. As a result, it is demonstrated that the use of the ground plane. under the signal line, and the adjacent ground...
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