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Three-dimensional (3-D) integration, a breakthrough technology to achieve “More Moore and More Than Moore,” provides numerous benefits, e.g., higher performance, lower power consumption, and higher bandwidth, by utilizing vertical interconnects and die/wafer stacking. This paper presents an overview of 3-D integration along with various design challenges and recent innovations. —Partha Pande, Washington...
The emerging three-dimensional integrated circuit (3D IC) provides a promising solution for sustainable computer performance scaling. However, the high cost due to the complex pre-bond/intermediate testing and the low compound yield hinder the commercial adoption of 3D ICs. The defect clustering is found biasing the yield prediction, resulting in an unrealistic cost estimation at the early design...
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