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Lateral growth of nickel coating on a ferrite substrate during electroplating of multilayer chip inductors (MLCI) was investigated. It was found that the lateral growth occurred after a certain time of electroplating, but not at the initial stage. Resistivity of the ferrite and inductance of MLCI decreased continuously with electroplating time. Moreover, surface morphology of the ferrite changed significantly...
Functional degradation of NiZnCu-based multilayer chip inductors (MLCI) during nickel electroplating and subsequent lateral growth of metal coating on the ferrite substrate were studied. It was found that the resistivity of the NiZnCu ferrite and inductance of MLCI decreased continuously during the electroplating. Scanning electron microscopy (SEM) analysis showed that the surface morphology of the...
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