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Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h,...
The 3D FE simulation performed in this work was used to deal with the experimental measured data, and to get the Coffin-Manson equation for lifetime prediction. Low cycle fatigue tests and FE simulations were performed on Sn-8Zn-3Bi lead free solder joints, and the Sn-37Pb eutectic solder was used as reference. The Coffin-Manson equation for the Sn-8Zn-3Bi lead free solder was fitted from the experimental...
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