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High-density interconnects including redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer require effective crosstalk-reduction signaling schemes. In this letter, a novel ground RDL lines structure utilizing ohmic contact is proposed for coupling mitigation, where the conventional insulator layer between the silicon substrate and the ground RDL lines is removed. An equivalent...
A novel type of three-dimensional (3D) frequency-selective surface (FSS) based on vertical graphene micro-ribbons is demonstrated to realize dynamic tunability of the frequency selectivity. The proposed structure is based on a two-dimensional array of vertical graphene micro-ribbons which are printed on the dielectric substrates with metallic ground planes placed at the bottom. A transmission line...
The signal transmission along interconnect based on graphene nanoribbon (GNR) is studied in this paper. Equivalent circuit models are implemented to characterize graphene-based interconnect and analyze its signal integrity. In equivalent circuits models, the inter-layer mutual impedance (capacitance and inductance) between adjacent layers has been taken into consideration. Meanwhile, we proposed both...
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