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High-density interconnects including redistribution layers (RDLs) and through-silicon-vias (TSVs) in silicon interposer require effective crosstalk-reduction signaling schemes. In this letter, a novel ground RDL lines structure utilizing ohmic contact is proposed for coupling mitigation, where the conventional insulator layer between the silicon substrate and the ground RDL lines is removed. An equivalent...
The signal transmission along interconnect based on graphene nanoribbon (GNR) is studied in this paper. Equivalent circuit models are implemented to characterize graphene-based interconnect and analyze its signal integrity. In equivalent circuits models, the inter-layer mutual impedance (capacitance and inductance) between adjacent layers has been taken into consideration. Meanwhile, we proposed both...
This Graphene is a two-dimensional material with one-atom thickness, high carrier mobility and high thermal conductivity. The resistance of graphene can be tuned in the range of 30∼100Ω by adjusting its dc bias, which have wide applications in RF circuit design. Its extraordinary features provide a new extension for the next generation of high-speed electronic integrated circuits. In this paper, the...
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