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Small Outline Transistor (SOT) package is a small, inexpensive, surface mount plastic-molded package, commonly used in consumer electronics. During the process of SOT packaging, the contamination is occasionally found on some SOT leads, which prevents the soldering in the assembly process. In this paper, an integrated failure analysis to solve the contamination problem is present. The surface topography...
This article introduced the concept of migrating workflow and transaction, described the most critical atomicity and conformance requirements in the transaction properties, proposed the concept of transactional workflow and the four properties that need to meet, finally, analyzed the features of migrating workflow and the unique requirements of the transaction properties, and gave the transaction...
With the characteristics of technology-density, system-complexity, and high cost and risk, to organize and run a space mission is extremely complex system engineering. The commanders must pre-planning and do some coordination arrangements detailedly and repeatedly, but still the space mission often is completed with high cost and risks. In order to solve these problems, the author does some research...
A distributed and integrated framework for missile design and manufacturing is developed in this study, using multidisciplinary optimization and workflow technology. The framework contains technologies of application integration, information integration and process integration. It can reduce the complexity of data exchange among disciplines, shorten the product development cycle and cut down the cost...
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