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Quad flat no-lead (QFN) packages are widely used in portable electronic products due to its excellent performance and lower cost. The electrical connection of QFN package is accomplished through solder-paste printing and it includes an exposed thermal pad to improve heat transfer. In addition, with the development of package technology, the pitches of QFN packages are designed smaller and multi-row...
Quad flat no-lead (QFN) packages are widely used in portable electronic products due to its excellent performance and lower cost. The electrical connection of QFN package is accomplished through solder-paste printing and it includes an exposed thermal pad to improve heat transfer. In addition, with the development of package technology, the pitches of QFN packages are designed smaller and multi-row...
Stacked chip packaging (3D packaging) is an effective method to increase the density of electronic packaging, due to the packaging density on an single chip has reached the limit of current packaging process. In stacked chip packaging system, additional chips are implemented on a single chip in the third dimension, thus multiply enhance the density of electronic packaging, while the packaging size...
Small Outline Transistor (SOT) package is a small, inexpensive, surface mount plastic-molded package, commonly used in consumer electronics. During the process of SOT packaging, the contamination is occasionally found on some SOT leads, which prevents the soldering in the assembly process. In this paper, an integrated failure analysis to solve the contamination problem is present. The surface topography...
Residual stress is commonly generated during the packaging process, and may heavily affect the electrical performance of the devices in silicon chips. Finding out the stress distribution and the relationship between packaging process and inducement of stress, can help us improve the packaging process, and figure out potential causes of the chip failure. In this study, a series of experiments are performed...
Flip chip packaging system consists of different materials in the connecting parts, and has an undesirable stress distribution on the chips. Large residual strain will lead to a deterioration of the circuit performance, andresearchers are working to reduce the residual strain in the packaging system. In our work, a silicon stress sensor chip is fabricated to measure the stress distribution in flip...
In this paper, a new kind of benzocyclobutene-functionalized siloxane monomer, 1,3,5,7,-tetramethyl-1,3,5,7-tetra[2'-(4'-benzocyclobutenyl)]vinylcyclotetra-siloxane (CYC-BCB), is synthesized and characterized. For comparison, the commercialized resin, 1,1,3,3-tetramethyl-1,3-bis [2'-(4'-benzocyclobutenyl)]vinyldisiloxane (DVS-BCB) is also prepared. Partially polymerized resins, P-DVS-BCB, P-CYC-BCB,...
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