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To meet the requirements for future fine pitch and high-performance interconnects in advanced packaging, ICAs with nano-materials are attracting more and more interest due to their specific electrical, mechanical and optical properties. There has been extensive research on nano-conductive adhesives containing nanofillers such as nanoparticles, nanowires or carbon nanotubes. In this paper, copper nanoparticles...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
Thermal issues increase with the electronic industry pushing towards fast in high speed, high density, and high performance. Thermal conductive materials are strongly demanded for increasing heat dissipation and reducing operating temperature of devices. Hexagonal boron nitride (h-BN) nanosheet that owns high thermal conductivity and low coefficient of thermal expansion is a good filler candidate...
To meet the requirements for future fine pitch and high-performance interconnects in advanced packaging, ICAs with nano-materials are attracting more and more interest due to their specific electrical, mechanical and optical properties. There has been extensive research on nano-conductive adhesives containing nanofillers such as nanoparticles, nanowires or carbon nanotubes. In this paper, copper nanoparticles...
Copper nanoparticles are alternative for silver and gold nanoparticles which are currently used in inkjet printing of conductive patterns because of the low price and high electrical conductivity. However, the serious impediment to using copper nanoparticles for conductive inks is their spontaneous oxidation. In the paper, the well-dispersed antioxidative copper pastes were prepared by dispersing...
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