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As a low cost solution to realize a fine line structure for high density chip interconnection, the thin film organic substrate that adopted the same concept as flip chip RDL (redistribution layers) technology has been developed in this study. The coarse line of a conventional substrate could be refined to a much finer distribution through the application of a thin film process. The thin film layers...
Wafer bumping is a key process for flip chip packaging. There are several bumping techniques such as ball drop, electroplating and stencil printing, in which stencil printing is thought to be an economical choice because it is compatible with conventional SMT technology. However, when bump pitch is less than 100 μm, it becomes more difficult to control the deposition volume of the solder paste. In...
Wafer bumping is a key process for flip chip packaging. There are several bumping techniques such as ball drop, electroplating and stencil printing, in which stencil printing is thought to be an economical choice because it is compatible with conventional SMT technology. However, when bump pitch is less than 100 μm, it becomes more difficult to control the deposition volume of the solder paste. In...
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