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Thermal interface materials (TIMs), including thermal conductive adhesives (TCAs), grease, phase change materials (PCMs) and thermal pads, are widely used in thermal management for electronics system. In this work, a bimodal thermal conductive adhesive (b-TCA) composed of epoxy matrix and silver fillers were developed. The silver fillers consist of silver flakes and silver particles. The specimens...
A simulation with combination of a finite element analysis of Thermally Conductive Adhesive and contact resistance modeling has been presented. Using ANSYS and MATLAB software thermal conductivity and electrical resistivity of Conductive Adhesives with Ag filler and Epoxy matrix has been calculated. Thermally Conductive Adhesives are used as a thermal interface material to provide a better conduction...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
This paper investigates variations in the electrical properties of a typical isotropic conductive adhesive (ICA) with an epoxy-based binder that are caused by differences in the curing conditions. In-situ monitoring of the various processes that were used to cure the ICA revealed that electrical conduction in ICA specimens depends on both the high-temperature curing conditions and the cooling conditions...
The thermal conductivity of a practical isotropic conductive adhesive (ICA) comprising of an epoxy-based binder containing flake-shaped and spherical Ag particles has been studied. The specimens exhibit anisotropy in their thermal conductivities. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are...
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