The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This study presents a new test method for Through Silicon Via (TSV) in 3D stacked ICs, in which a Delay-Locked Loop (DLL) is utilized to detect TSV defects. As compared to TSV test methods using free running ring oscillators, the proposed method presents a much better performance against Process, supply Voltage and Temperature (PVT) variations due to the inherent feedback of DLL systems. In the proposed...
Multichannel die probing increases test speed and lowers the overall cost of testing. A new high-density wafer probe card based on MEMS technology is presented in this paper. MEMS-based microtest-channels have been designed to establish high-speed low-resistance connectivity between the die-under-test and the tester at the wafer level. The proposed test scheme can be used to probe fine pitch pads...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.