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In this study, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, carrier material and thickness, and die-attach film, on the warpage after post mold cure (PMC) and...
With the development of optoelectronics and microelectromechanical systems (MEMS) packaging, laser soldering has become an extensively used interconnection technique in electronic manufacturing industry. Postsolder shift in assembling of such components is the most challenging issue to affect the packaging yields. To maintain a high coupling efficiency or accuracy, tight control of postsolder shift...
Generally, the purpose of soldering is to provide a robust joint. However, for a microsensor assembly, precise position or appropriate pose of the component in operation is also a major concern to ensure monitoring the target effectively. In the present work, a three-dimensional finite element thermal-mechanical indirectly coupled model was developed to investigate the pitch motion induced by laser...
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