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There are several identified failure mechanisms such as void formation and propagation, the local melting mechanism and the underbump metallization (UBM) dissolution in flip chip solder joints. In our previous studies Ni(V) UBM consumption was also found to cause the failure. The flip chip solder joint used in this study was with Al/Ni(V)/Cu UBM on the chip side and an Au/Ni surface finish on the...
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