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In this paper, thermal cycling tests and finite-element analysis (FEA) for a plastic ball grid array package with Sn–3.8Ag–0.7Cu lead-free solder joints have been performed. The solder joint fatigue lives were predicted and compared by using different 2-D and 3-D FEA models. The effects of solder constitutive models and fatigue life models on solder fatigue life prediction have been investigated....
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