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Three-dimensional (3D) integration is considered as a solution to overcome capacity, bandwidth, and performance limitations of memories. However, due to thermal challenges and cost issues, industry embraced 2.5D implementation for integrating die-stacked memories with large-scale designs, which is enabled by silicon interposer technology that integrates processors and multiple modules of 3D-stacked...
As the number of processing elements increases in a single chip, the interconnect backbone becomes more and more stressed when serving frequent memory and cache accesses. Network-on-Chip (NoC) has emerged as a potential solution to provide a flexible and scalable interconnect in a planar platform. In the mean time, three-dimensional (3D) integration technology pushes circuit design beyond Moore's...
This paper gives the analysis of the feature of the medium voltage powerline communication in the view of reliability, investment and flexibility and the discussion of the necessity of routing automatically, compares the advantages and shortcomings of the bionic algorithms people research on a lot. It proposed an improved automatically dynamic routing algorithm for medium voltage powerline communication...
Three dimensional integrated circuits (3D ICs) are currently being developed to improve existing 2D designs by providing smaller chip areas and higher performance and lower power consumption. However, before 3D ICs become a viable technology, the 3D design space needs to be fully explored and 3D EDA tools need to be developed. To help explore the 3D design space and help fill the need for 3D EDA tools,...
Increasing levels of integration in field programmable gate arrays, have resulted in high on-chip power densities, and temperatures. The heterogeneity of components and scaled feature sizes in platform FPGAs have made them vulnerable to various temperature dependent failure mechanisms. Hence, we need to introduce temperature awareness in tackling such failures that affect the lifetime reliability...
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core/SoC systems in deep sub-micron technology. However, almost all prior studies have focused on 2D NoC designs. Since three dimensional (3D) integration has emerged to mitigate the interconnect delay problem, exploring the NoC design space in 3D can provide ample...
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