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This paper presents a thermomechanical study of the stresses which eventually occur in through glass vias (TGVs) due to the coefficient of thermal expansion (CTE) mismatch. The objective of the analysis is to assess the thermal stress variations in TGVs of different geometries. The main contribution of this paper is the elaboration of mathematical models to describe the thermomechanical stress in...
As the request for high preferment and reliable 3D Integrated Circuit (IC) packages is increasing. Investigations in this technology are accelerating with the aim to reduce both cost and size. Glass interposer is recently used in this domain, it represents an effective alternative to the silicon due to its low cost, ease manufacturing and low electrical parasitic effects and cross talk. Although,...
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