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For cell phone cameras the glass is a promising material as an interposer for 3D microelectronic and multifunctional packaging thanks to its insulation proprieties. Compared to silicon, glass provides better electrical performances. In this work, we present a new electrical modeling approach, based on physical parameters, for the glass interposer with through package vias (TPV). First, we develop...
Glass interposer with through package vias is a promising 3D-IC packaging technology that is expected to be used widely in the near future thanks to its numerous benefits. This technique is still being developed in research laboratories because of its low yield compared to the Through Silicon Vias which is produced on an industrial scale. In this paper, we report on our progress regarding the fabrication...
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