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Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400°C. Complete consumption of In solder into a Ag-rich intermetallic...
A miniaturized probe for MEMs based devices used in OCT application has been developed. Laser and mechanical dicing are used for singulating the released MEMs devices, however resulted in damaged devices. Therefore, thick photoresist is used to overcome and protect the devices during dicing. A fluxless solder ball process using different ball dimensions are experimented. Silicon bench is used for...
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