The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The increasing use of Cu/low-k dielectrics as multilevel interconnect inclusion materials and aggressive scaling in advanced back-end of line (BEOL) results in a considerable challenge in the structural enhancement of mechanical reliability. Owing to the expected adoption of various ultra dielectrics, the development of a prediction methodology with reliable virtual prototypes is needed before realizing...
As the Cu/low-k interconnects integrated into the next-generation IC chip, particularly for devices below 90 nm, to meet the requirements of reducing RC time delay and low power consumption, how to establish a feasible and robust solution of packaging technology regarding to the structural design as well as the material selection of packaging components has become more important to fulfill the fast...
As the technology of the semiconductor process continues to move forward, the next generation IC chip with copper/low-k stacked structures is being developed for reducing the RC delay in order to obtain high-speed signal communication. However, there is a high potential that in doing so it may contribute to interfacial cracks occurring or propagating between the copper interconnections and the low-k...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.