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Moisture is a significant contributing factor to the failure of microelectronic packaging including phenomena such as popcorn cracking, delaminations, and interfacial fracture. While the effects of moisture have been examined extensively in plastic encapsulated packages (e.g. DIP and PBGA), there have been no published studies on the effects of underfill and substrate moisture absorption on the die...
In this work, we have used test chips containing piezoresistive sensors to characterize the in-situ die surface stress evolution during thermal cycling of flip chip ceramic ball grid array (FC-CBGA) components suitable for microprocessor packaging. The utilized (111) silicon test chips were able to measure the complete three-dimensional stress state (all 6 stress components) at each sensor site being...
The increasingly complex packaging used in modern workstations and servers transmits a complicated set of mechanical loads to the microprocessor. Increasing die size, high CTE ceramic substrates, lead free solder joints, and ever increasing power requirements have led to increased die stress levels in packaged microprocessor die. Such stresses can degrade silicon device performance, as well as damage...
On-chip piezoresistive stress sensors represent a unique approach for characterizing stresses in silicon die embedded within complicated packaging architectures. In this work, we have used test chips containing such sensors to measure the stresses induced in microprocessor die after various steps of the assembly process, as well as the stress changes occurring due to thermal cycling. The utilized...
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