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Product reliability is crucial to the success of a company. Product qualification today is based on standards that follow a stress-test driven approach, meaning pre-defined stress tests with pre-defined stress conditions. However, reliability requirements have increased, while at the same time both designs of semiconductor components and usage of these components in the applications have increasingly...
Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
Delamination remains a major problem for the reliability of semiconductor components. It is typically addressed with temperature cycling tests, which are rather time-consuming. The paper presents an approach to provide data for material selection in the early development phase based on adhesion measurements and simulation. The approach provides an improved base for decision and allows to reduce development...
Chip-package interaction is a major concern for product reliability. Temperature cycling is a commonly used stress test to address this issue. The paper shows that temperature shock can substitute temperature cycling for certain failure mechanisms, thereby reducing stress times by a factor of 28 or even more.
Power stages are subject to severe stress due to active cycling, resulting in e.g. fast thermal cycling. While some applications require several hundred millions of cycles under normal operation conditions, ldquodisturbancesrdquo such as short circuit pose additional challenges. These issues are neither addressed by ldquoclassicalrdquo silicon wafer technology qualification nor by standard product...
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