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Delamination at heterogeneous metal/polymer interfaces during reliability testing of packaged devices continues to be a reliability issue in microelectronic packaging. Although interfacial adhesion properties are largely determined by molecular structures at buried interfaces, structure-property relationships at buried metal/polymer interfaces are not well understood due to a lack of nondestructive...
In order to enhance thermal conductivity of underfill materials, hexagonal boron nitride (h-BN) was employed as a thermally conductive filler. The relationship between the filler morphology and its effects on the thermal conductivity is focused in this study. Two different h-BN fillers with different morphologies were applied to generate an efficient thermal transport path through the filler and epoxy...
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