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Stacked die package using capacitive-based chip-to-chip signaling offers low energy-per-bit costs and high I/O density. Many previously published works on capacitive proximity I/O have focused on mechanical methods for accurate chip alignment. This paper explores design considerations to address stacked die structures with differential signaling chip-to-chip communication based on capacitive coupling...
A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. This paper describes a loopback architecture suitable for testing three-dimensional integrated circuit (3D...
The use of organic semiconductor thin film of Alq3 to design parasitic capacitance coupling parasitic for a referenced circularly polarized microstrip patch antenna is demonstrated in this report. Results of the measurements lead to the conclusion that the Alq3 thin film capacitive coupling parasitic influences the circularly polarization significantly with little shift of operation frequency.
The electromagnetic field can be radiated when a signal is transmitted along the radiators on an antenna; meanwhile, evanescent coupling occurs in parasitic elements. This report is demonstrated to characterize grating level displacements of the components and depicts the criterion of evanescent coupling for the design of the microstrip patch antenna array in future to amplify the feed network.
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