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In this paper, we measured and analyzed glass interposer power distribution network (PDN) resonance effects on a high-speed through glass via (TGV) channel for the first time. To verify the glass interposer PDN resonance effects on the TGV channel, glass interposer test vehicles were fabricated. With these test vehicles, glass interposer PDN impedance, channel loss, far-end crosstalk, and eye diagram...
These days, mobile devices require low-power consumption. To meet these requirements, IC's operating voltage is continuously lowered. As a result, power noise margin decreases which require more precise Power Distribution Network (PDN) design. In this work, we simulated and analyzed the mobile Application Processor (AP) GPU system based on Chip Power Model (CPM). We applied GPU's current model to...
A 3-D stacked high bandwidth memory (HBM) becomes a promising solution to satisfy the memory bandwidth for the processor. Due to its unique memory architecture that consists of tremendous number of input/output (I/O), it is inevitable to employee Silicon based interposer. Therefore, power distribution network (PDN) design and analysis of HBM interposer becomes one of the important step to guarantee...
A semiconductor industry has been encountered a memory bandwidth bottleneck toward a high density and high bandwidth system. In order to overcome those limitations, a 3D stacked high bandwidth memory (HBM) based on a through silicon via (TSV) and fine pitch interposer technology is lately introduced. By adopting this structure, thousands numbers of input/output (I/O) channels with a fine pitch can...
In this paper, frequency dependent target impedance is proposed for optimal Power Distribution Network (PDN) design. Target impedance indicates how much and where decoupling capacitors should be located in the PDNs therefore it directly affects performance of the electrical systems or manufacturing cost. In this paper, frequency dependent target impedance considering IC's power current spectrum is...
2.5D integration based on interposer technologies provides high density integration and high system bandwidth. Among many materials for the interposer substrate, glass could be a promising material since it provides low signal loss and its ultra-thin thickness. When chips are stacked on the glass interposer, power distribution network impedance of 2.5D IC must be estimated, analyzed and optimized...
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