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Future low carbon generation scenario would see an enhanced grid penetration of green generation sources like wind and solar, thus replacing the traditional generators. This may lead to sudden imbalances between generation and load, leading to drop in system frequency. The low inherent inertia and primary frequency response (PFR) capability of these non-synchronous generators would result in large...
PIN tunneling field effect transistor (TFET) is one of the most promising devices due to its low sub-threshold swing. In this paper, using TCAD simulation, we investigate the doping and structure dependence of the electric field in PIN TFET. We show that an insertion of a thin N layer into PIN structure (i.e., PNIN TFET) not only enhances the drive current but also improves the reliability of the...
This paper presents basic guidelines on design considerations for wind power plant substation and collector system based on redundancy, reliability, and economics. Design considerations, although similar to utility substation and underground or overhead distribution systems, often include aspects not normally considered for those systems. This paper will highlight design considerations unique to wind...
Implementation of transmission access arrangements under BETTA, in the UK, has encouraged applications for offers to connect generation to the grid. Network operators have consequently been presented with a vast amount of applications before end of 2004. Boosted by governmental targets of securing 10% of electricity generation from renewable resources by 2010 and 20% by 2020 and widespread public...
The amount of conventional resources (mainly thermal) that could be 'replaced' by renewable production, without making the system less reliable is defined as the capacity credit of the renewable plant(s). For any proper assessment of the capacity credit, it is primordial to be able to assess the reliability of the power system network. Ideally, the reliability of the network before the introduction...
Passivation cracking is one of the main failures of integrated circuits (ICs) and thermo-mechanical failures are the root cause. A major cause for these failures is due to the mismatch of thermal and mechanical parameters while manufacturing or working, especially stress concentration at the interface and the edge. The ICs for different fixing position endure different thermal cycles, overload and...
Compilers designed for current embedded systems must be capable of addressing multiple constraints such as low power, high performance, small memory footprint and form factor, and high reliability at the same time. In particular, optimizing for one constraint should be performed carefully, considering its impact on other constraints. Recent trends indicate that transient errors are becoming increasingly...
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