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Electrically conductive adhesives are widely used in semiconductor technology. The focus of this work is set on Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles. The aim of this work is the material characterization of highly filled epoxy based die attaches materials by dynamic mechanical analysis (DMA) and relaxation experiments in order to derive...
An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPNF (with silica particles) and a native silicon dioxide layer (SiO2) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water,...
In this work we present a procedure for the construction of 3D networked epoxy moulding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations. Our investigations present part of general trend to extend failure analysis, reliability assessment and the development of packaging materials from the conventional discrete usage of simulation techniques to a more...
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