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This paper proposes a novel wafer-level packaging (WLP) method at room temperature for piezoresistive pressure sensors. We use a polydimethylsiloxane (PDMS) sheet as a candidate for replacing a Pyrex glass wafer, to seal the backside V-grooved chambers of the pressure sensor chips. PDMS is a well-known material in MEMS technology recently. It is not only cheap but also has a merit of a simple process...
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