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Power QFN Tiger device failed the down bond open on TC500 or application. Failure analysis verified that it was caused by down bond delamination. Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point. Meanwhile, new bonding model with security loop was applied to down bond to improve...
Power QFN Tiger device failed the down bond open on TC500 or application. Failure analysis verified that it was caused by down bond delamination. Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point. Meanwhile, new bonding model with security loop was applied to down bond to improve...
Although color shift is one of the key issues to be considered for the failure of LEDs products, there is limited literature that correlated LED products' lifetime performance to their color shift over time. This is mainly due to the lack of a suitable model to define the color shift over time. In this paper, a methodology for characterizing and predicting the color shift of the polycarbonate materials...
This paper presents a state-of-the-art 28nm CMOS technology using conventional poly gate and SiON gate dielectric (Poly/SiON) with best-in-the-class transistor performance, SRAM SNM (static noise margin), MOM capacitance density and mismatch, and ULK (k=2.5) interconnect. The ION are 683 and 503 uA/um (at IOFF = 1nA/um, VDD=1V) for the n- and p-MOSFET, respectively. (With normalized tOX and VDD, these...
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