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The effects of the melt state on the microstructure of Sn–3.5%Ag solder were investigated at two different cooling rates. The results show the solid–liquid interface energy is found to increase when the alloy is melted at above liquid–liquid structure transition (L-LST) temperature. Consequently, the melts require a larger undercooling to nucleate and a slower rate to grow. Finally, the solidification...
In this work, we described an electrospinning process for creating superhydrophobic thermoplastic polyurethanes (TPU) mat with bead-on-string morphologies. The initially hydrophobic TPU electrospun film presented superhydrophobic trait after treatment with hydrophobic nanosilicas, which was pre-fabricated by refluxing nanosilicas in a toluene solution of hexadecyltrimethoxysilane (HDTMS). The relationship...
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