The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A novel TSV structure, formed by two semi-cylinders combining with a quadrangular is proposed and analyzed in this paper. This novel structure can enhance the density of TSV array without significantly decreasing transmission performance and reducing impedance mismatch in TSV-RDL transmission line or depressing the signal crosstalk. Effects of design parameters, such as the side length of quadrangular...
A novel TSV structure, formed by two semi-cylinders combining with a quadrangular is proposed and analyzed in this paper. This novel structure can enhance the density of TSV array without significantly decreasing transmission performance and reducing impedance mismatch in TSV-RDL transmission line or depressing the signal crosstalk. Effects of design parameters, such as the side length of quadrangular...
This paper reports a thick film accelerometers based on LTCC technology. The authors introduce a LTCC compatible design and develop a fabrication process flow of this new kind of accelerometer, and moreover, samples for testing are fabricated. It is designed as a piezoresistive accelerometer, which consists of a proof mass, two parallel leaf springs, and a fixed frame. The sensing device may be embedded...
In this paper, we present our recent advances in streamlining via-last TSV process flow. Parylene deposition, which is of excellent conformability to the substrate landscape, was introduced into TSV blind via filling process to realize uniform sidewall protection. Simulation was made to analyze the impacts of parylene sidewall on the electric field distribution inside a blind via with high aspect...
A TSV (Through Silicon Via) structure with I-shaped structure for 3D packaging is proposed in this paper. Based on the notching effect and gradient etching process of DRIB, this kind of structure can be fabricated in the existed facilities, without additional processes and equipments. According to microwave transmission line theory and by using finite element full-wave analysis tool, simulation of...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.