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Formation of AuSnx IMCs in laser reflowed solder joints protected by N2 atmosphere at room temperature, 60°C, 100°C and 130°C was investigated respectively. The solder balls were Sn-2.0Ag-0.75Cu-3.0Bi, and 120μm in diameter. The surface finish of one pad in the solder joints was 4.0μmAu/0.1μmNiFe/0.01μmTa, the other pad was made of Cu plated with 3.0μm thickness of Au. The laser reflow time was within...
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