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The reactive diffusion between Sn–Ag solders and Cu was experimentally examined during soldering and isothermal annealing. Three sorts of solders with compositions of Sn–3.5Ag, Sn–3.5Ag–0.1Ni and Sn–3.5Ag–0.1Co were used for the experiment. Each solder was soldered on a Cu plate at 523K (250°C) for 1–60s in a pure nitrogen gas, and then the solder/Cu diffusion couple was isothermally annealed at 423K...
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