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We report on the flip chip packaging of Micro-Electro-Mechanical System (MEMS)-based digital silicon photonic switching device and the characterization results of 12 × 12 switching ports. The challenges in packaging N 2 electrical and 2N optical interconnections are addressed with single-layer electrical redistribution lines of 25 μm line width and space on aluminum nitride interposer and 13° polished...
We report on the packaging of the 50 × 50 MEMS-actuated silicon photonics switching device through flip-chip assembly and a lidless 64-channel fibre array polished at 13° angle. The device, measuring 10 mm × 10 mm, contains more than 2500 bond pads with a dimension of 65 μm × 65 μm, with the actuating MEMS structures locating 15 μm away at 4 sides of each bond pads. An average switching voltage of...
Using electron-beam-induced deposition and focused-ion-beam milling, we have fabricated and demonstrated a nanofocusing optical transformer with a 3-dimensionally tapered tip. At the tip, the light is confined to 13-by-80-nm area with intensity enhancement exceeding 1500.
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