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This paper presents a Cu-Ni nanocomposite film and related CMOS compatible fabrication process using alkaline noncyanide based copper plating solution for low power magnetic microactuation application. The magnetic properties of Cu can be modified from diamagnetism to ferromagnetism via the incorporation of Ni nanoparticles into a Cu matrix to form a Cu-Ni nanocomposite film. Experimental results...
A flip-chip interconnect is proposed to achieve good electrical performance applicable to millimeter-wave applications. By Au-Au thermocompression technique, the transition structure provides continuity of characteristic impedance from the on-carrier CPW line to the on-chip microstrip line, as well as smooth current flow. Parameter optimization further indicates that the tapered reference ground connection...
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