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The higher stiffness of Pb-free SAC solders makes Pb-free assemblies more sensitive to drop impact. In order to be able to optimize the drop test performance, it is necessary to have better insight into the crack propagation in the Pb-free solder joints. This study combines crack-front mapping using the dye and pry method and electrical FE simulation to establish a relation between DC electrical resistance...
This paper presents a study of the resistance of solder joints to failure when subjected to strain rates that simulate the conditions of drop impact on a portable electronic product. Two test methods are used in this study: board-level drop/shock test (BLDT) and component-level ball impact test (BIT). The performance of 12 material combinations consisting of 6 solder alloys and 2 pad finishes were...
Medium strain rate (0.1/s to 300/s) constitutive properties are needed for accurate modeling of drop impact conditions. This study presents an experimental procedure for obtaining the material properties of solder alloys at these medium strain rates. The effect of grain size on the medium strain rate behavior of solder alloys is also studied, using SnPb alloy as an example. Grain size variation is...
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