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Single shear lap creep specimens with a 1 mm2 cross sectional area (similar in size to small lead-free solder joints used in electronic packaging and jointing) between thin copper strips were developed and fabricated using lead-free solder (Sn-3.5Ag) to quantify their creep strain with in situ micro electronic-resistance measurement. Where the solder joints' micro electronic-resistance is in situ...
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