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In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical...
In this paper, we present transmission electron microscopy (TEM) investigations of a potential failure mode for Cu lines subjected to alternating thermal loads. Wide Cu lines with 200 nm thickness were produced on a Si/SiO2/SiNx wafer by a series of conventional microfabrication steps. Alternating currents (AC) with a frequency of 100 Hz was then applied to the Cu lines and produced temperature cycles...
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