The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In 2006, the European Union restricted lead (Pb) to > 0.1% (by weight) in electronics. This caused a renewal of interest in Sn whiskers, as the absence of Pb in Sn films had been known for years to promote Sn whisker growth. The early work on Sn whiskers had suggested that elements other than Pb may suppress whiskers. Bi was chosen as an attractive candidate, as it has similar phase formation behavior...
(Part A) Work by Hoffman (Savannah River National Laboratory) reported Sn whiskers which grew longer in nitrogen (sealed jar) environments compared to air environments. This is of concern in electronics systems which operate in nitrogen-backfilled environments, such as hybrid circuits and sensor systems. In this work we compare Sn whiskers grown in two different environments-pure N2 and ultrahigh...
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC)...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25degC) and elevated...
Thermal cycling accelerated life testing is often used to qualify area array packages (e.g. Ball Grid Arrays and Flip Chip) for various applications. Finite element life predictions for thermal cycling configurations are challenging due to the complicated temperature/time dependent constitutive relations and failure criteria needed for solders and encapsulants and their interfaces, aging/evolving...
Thermal cycling accelerated life testing is often used to qualify packages for various applications. Finite element life predictions for thermal cycling configurations is challenging due to the complicated temperature/time dependent constitutive relations and failure criteria needed for solders and encapsulants and their interfaces, aging/evolving material behavior (e.g. solders), difficulties in...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.