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Failures in electronics subjected to shock and vibration are typically diagnosed using the built-in self test (BIST) or using continuity monitoring of daisy-chained packages. The BIST which is extensively used for diagnostics or identification of failure, is focused on reactive failure detection and provides limited insight into reliability and residual life. In this paper, a new technique has been...
In this paper, a leading indicators based approach has been developed for prognostics and health monitoring of electronic systems. The approach focuses on the prefailure space and methodologies for quantification of damage progression and residual life in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Traditional health monitoring...
In this paper, the feature extraction for health monitoring based on optical measurements of transient-strain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated. Full-field measurement of transient strain have been made in various board assemblies subjected to shock in various orientations. Feature-extraction for health monitoring of leadfree area...
In this paper we introduce an in-situ solder-joint built-in self-test (SJ BIST) for detecting high-resistance faults in operational, fully-programmed field programmable gate arrays (FPGAs). The approach is simple to implement, offers a method to detect high- resistance faults that result from damaged solder-joints, and uses a maximum of one small capacitor externally-connected to each selected test...
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