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Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica...
Thermal cycling accelerated life testing is often used to qualify area array packages (e.g. Ball Grid Arrays and Flip Chip) for various applications. Finite element life predictions for thermal cycling configurations are challenging due to the complicated temperature/time dependent constitutive relations and failure criteria needed for solders and encapsulants and their interfaces, aging/evolving...
Electronic assemblies are approximately "stress free" near their assembly temperature, which is typically above 150 degC when encapsulants and solders are involved. As the assemblies are cooled below room temperature, the temperature difference between ambient and "stress free" conditions becomes extremely high, and the thermal expansion mismatch induced stresses, strains, and...
Silica filled epoxy encapsulants used for microelectronic packaging are known to exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Most aging effects are typically exacerbated at higher temperatures at or above the glass transition temperature (Tg) of the encapsulant. Such extremes are often used during the high temperature...
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