The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The study conducts the reliability test of the flip chip ball grid array (FCBGA) components with both the cyclic bend tests and shear tests for three types of solder materials: the eutectic solder with compositions of Sn63Pb37, and the lead free solder with compositions of both SnAg3.0Cu0.5 and SnAg4.0Cu0.5. The final results for the cycles to failure data of different solder ball materials are plotted...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.