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An equivalent circuit consisting of eight frequency independent lumped elements is derived for center-driven normal mode helical antennas. The equivalent circuit is composed of two parts; a five-element circuit representing the wire antenna and a three-element circuit for the helical turns. Comparison of the calculated input impedance of the equivalent circuit with full-wave simulations demonstrates...
Wafer-Level Packaging (WLP) has emerged in modern years and played a prominent role in both semiconductor and Integrated Circuit (IC) field, as well as in Micro-ElectroMechanical Systems (MEMS) applications and fields for their distinguishing operating mechanism and adaptive design variety. In this study, numerous kinds of mature packaging technologies combined with innovation as well as integration...
Wafer Level Packaging (WLP) has started to shine and played a prominent role in recent years in both semiconductor and Integrated Circuit (IC) field, especially in now thriving Micro-Electro-Mechanical System (MEMS) applications on account of its distinctive operating mechanism and adaptive design variety. In this study, several crucial WLP technologies are disclosed in detail, including Wafer to...
Wafer Level Packaging (WLP) has started to thrive in recent years in IC packaging domain, especially in Micro-Electro-Mechanical Systems (MEMS) field due to its unique operating characteristic and design diversity. In this paper, several significant WLP technologies, including wafer to wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding, and compound lapping, are disclosed...
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