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The fabrication process of an 80 nm In0.7Ga0.3As MHEMT device with flip-chip packaging on Al2O3 substrate is presented. The flip-chip packaged device exhibited good dc characteristics with high IDS = 425 mA/mm and high gm = 970 mS/mm at VDS = 1.5 V. Besides, the RF performances revealed high gain of 10 dB at 50 GHz and low minimum noise figure (NFmin)below 2 dB at 60 GHz, showing the feasibility of...
80nm InAs/In0.7Ga0.3As HEMTs using Pt gate sinking were characterized for ultra-low power low noise applications. While the epitaxial structure of the device was optimized, the reduction of gate-to-channel distance was achieved from gate sinking process. The device exhibited very high drain current density of 1066 mA/mm and maximum gm of 1900 mS/mm at Vds = 0.5 V. Excellent fT (fmax) up to 113 GHz...
An 80-nm InP high electron mobility transistor (HEMT) with InAs channel and InGaAs subchannels has been fabricated. The high current gain cutoff frequency (ft) of 310 GHz and the maximum oscillation frequency (fmax) of 330 GHz were obtained at VDS = 0.7 V due to the high electron mobility in the InAs channel. Performance degradation was observed on the cutoff frequency (ft) and the corresponding gate...
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